The cooling effect of IC is closely related to the quality o
The heat dissipation effect of integrated circuits in most electronic products is closely related to the quality of dispensing packaging. In the process of dispensing packaging of electronic products, if the quality of CPU fan is affected, the heat dissipation effect of integrated circuits in the process of using electronic products is not very good. In the production process to prevent the CPU fan glue problems, you can choose to use multi-axis precision dispensing machine to complete the production work.
Selection of multi axis precision dispenser for CPU fan coating
The adhesive used in the CPU fan gluing process is CPU heat dissipation silica gel, also known as thermal conductive silicone grease, with good heat dissipation and thermal conductivity. The application in the CPU fan gluing process can not only improve the production efficiency of dispensing bonding, but also improve the heat dissipation effect of integrated circuits in electronic products. CPU radiation silica gel is coated between the fan and radiator. In the production process, the radiation silica gel can be uniformly coated to the fan surface through a multi-axis precision dispensing machine. When the electronic products are used for a period of time, the silicone grease in the fan needs to be replaced, so how can the silicone grease be replaced to ensure that the integrated circuit heat dissipation effect is not affected?
How to convert silicone grease to ensure that the heat dissipation effect of IC is not affected.
How can silicone grease ensure that the heat dissipation effect of IC is not affected? Then users need to pay attention to the operation method when changing silicone grease. Before replacing the CPU heat dissipation silica gel, it is necessary to clean up the original glue. After cleaning the silicone grease, the new CPU heat dissipation silica gel is coated into the fan through the multi-axis precision dispensing machine for bonding. The CPU fan glue coating work completed by the multi-axis precision dispensing machine can ensure the best integrated circuit heat dissipation effect.
The heat dissipation effect of integrated circuit is closely related to the quality density of CPU fan coated package, so we must pay attention to the use of operation methods in the production process of electronic products to ensure the heat dissipation quality of products.