Improving the dispensing accuracy of automatic dispensing machine largely determines the dispensing and quality effect of products. Some precision parts and handicraft products also need high-precision dispensing technology. However, the dispensing accura.
The welding effect of automatic welding machine equipment is well recognized by users. Many electronic products need soldering tin, which can be used. PCB products are often used in the industry, automatic soldering machine has what practical advantages, .
The price of spray dispenser has always been the concern of purchasers and manufacturers, because it is directly related to the cost and expenditure plan of enterprises. It is normal to compare the prices given by manufacturers every day and purchase equi.
The following is an effective way to solve the problems often occurring in the use of filling valves. 1. Leakage of rubber valve This often happens after the valve closes. 95% of the problem is caused by the use of needle caliber children. Too small needl.
Today, the glue maker is here to talk about the characteristics and classification of distributors. Because of its characteristics, it is efficient and effective. In terms of physical labor, it is lower than manual production. Machine efficiency can impro.
1. Leakage of rubber valves Leakage problems usually occur after the dispensing valve closes. 95% of the cases occur because the needle caliber is too small to match. Too small a needle can affect the flow of liquid and cause back pressure. Therefore, the.
The daily maintenance of glue coating machine directly affects its service life. Therefore, the daily maintenance of the glue coating machine can not only improve the quality of products, but also extend the service life of equipment, saving a lot of mone.
PUR hot melt adhesive is a kind of wet curing reactive polyurethane adhesive, which is widely used in paper, bottle cap, computer, mobile phone and other high-end applications. TP of flexible surface mobile phone combines with intermediate frame. It has e.
Bottom filling process is to apply glue to the edge of flip chip, through the capillary effect, the glue drops to the opposite side of the component. Fill the bottom, then the glue solidifies under heating. What is the requirement of dispensing proces...
In recent years, Chinas scientific and technological development has made rapid progress, especially in the electronic industry. However, every development in China is very unbalanced. There is a big gap between coastal and inland areas in production tech.